• DocumentCode
    2103576
  • Title

    Flexible substrate a-Si:H TFTs for space applications

  • Author

    Zhou, Lisong ; Jackson, Tom ; Brandon, Erik ; West, William

  • Author_Institution
    Dept. of Electr. Eng., Pennsylvania State Univ., University Park, PA, USA
  • fYear
    2004
  • fDate
    21-23 June 2004
  • Firstpage
    123
  • Abstract
    We have fabricated hydrogenated amorphous silicon (a-Si:H) TFTs on Kapton(R) polyimide flexible substrates and characterized their response to deployment-like mechanical stresses and to radiation exposure. To maintain substrate flatness and provide improved thermal transfer during fabrication, we used a pressure-sensitive silicone gel adhesive layer to mount Kapton(R) substrates onto glass carriers. The test results, presented in this paper, are encouraging for space use of a-Si:H TFTs on polymeric substrates. Device function was retained even after 1 Mrad fast electron irradiation, and irradiation-induced device changes were removed by low-temperature thermal annealing. Although some TFTs were destroyed by substrate stressing, the majority survived with only small changes, suggesting that care in device design and placement may reduce or eliminate this problem.
  • Keywords
    adhesives; annealing; radiation effects; silicones; space vehicle electronics; thin film transistors; 1 Mrad; Kapton(R) polyimide flexible substrates; Si:H; deployment-like mechanical stresses; fast electron irradiation; flexible substrate TFT; glass carriers; irradiation-induced device changes; low-temperature thermal annealing; pressure-sensitive silicone gel adhesive layer; radiation exposure; space application TFT; substrate flatness; substrate stressing; thermal transfer; Annealing; Dielectric substrates; Electrodes; Electrons; Passivation; Silicon compounds; Testing; Thin film transistors; Threshold voltage; Wet etching;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Device Research Conference, 2004. 62nd DRC. Conference Digest [Includes 'Late News Papers' volume]
  • ISSN
    1548-3770
  • Print_ISBN
    0-7803-8284-6
  • Type

    conf

  • DOI
    10.1109/DRC.2004.1367814
  • Filename
    1367814