DocumentCode
2109243
Title
Model of mutual coupling between two bonding wires on glass substrate
Author
Dinh, Thanh Vinh ; Pasquet, Daniel ; Descamps, Philippe ; Lesenechal, Dominique ; Pagazani, Julien ; Lissorgues, Gaelle ; Nicole, Pierre
Author_Institution
LaMIPS, Colombelles, France
fYear
2013
fDate
26-27 Sept. 2013
Firstpage
1
Lastpage
4
Abstract
This paper presents a simple model of mutual coupling between 2 bonding wires. The model has been compared to 3D full wave electromagnetic simulation up to 20 GHz. A good accordance was obtained.
Keywords
electromagnetic coupling; glass; lead bonding; substrates; 3D full wave electromagnetic simulation; bonding wires; glass substrate; mutual coupling; Bonding; Glass; Inductance; Mathematical model; Mutual coupling; Solid modeling; Wires; Bonding wire; Electromagnetic modeling; Mutual coupling;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Conference Dresden-Grenoble (ISCDG), 2013 International
Conference_Location
Dresden
Print_ISBN
978-1-4799-1250-6
Type
conf
DOI
10.1109/ISCDG.2013.6656302
Filename
6656302
Link To Document