Thermo-mechanical analysis of MEMS pressure sensor die-attach for high temperature applications

Author

Meyyappan, Karumbu ; McCluskey, Patrick ; Chen, LiangYu

Author_Institution

CALCE EPSC, Maryland Univ., College Park, MD, USA

Volume

4

fYear

2004

fDate

13-13 March 2004

Firstpage

2556

Abstract

The thermomechanical stress generated by the mismatch of the coefficients of thermal expansion (CTE) of the sensor base material (SiC) and the packaging has a significant impact on the reliability of the packaged sensor. In the current work, non-linear finite element analysis was performed to determine the peeling, shear stresses and the von Mises stresses, in the SiC pressure sensor and the die attach which is intended for high temperature operation. A parametric study has been conducted to study the effects of the substrate material and reference (stress-free) temperature.

Keywords

chip scale packaging; finite element analysis; high-temperature electronics; microassembling; microsensors; pressure sensors; reliability; silicon compounds; thermal expansion; thermal management (packaging); thermal stresses; wide band gap semiconductors; AlN; MEMS pressure sensor; SiC; SiC pressure sensor; coefficients of thermal expansion; die attach; high temperature applications; nonlinear finite element analysis; packaged sensor; peeling; reference temperature; reliability; sensor base material; shear stresses; substrate material effect; thermomechanical analysis; thermomechanical stress; von Mises stresses; Finite element methods; Materials reliability; Micromechanical devices; Packaging; Silicon carbide; Temperature sensors; Thermal expansion; Thermal sensors; Thermal stresses; Thermomechanical processes;

fLanguage

English

Publisher

ieee

Conference_Titel

Aerospace Conference, 2004. Proceedings. 2004 IEEE

Conference_Location

Big Sky, MT

ISSN

1095-323X

Print_ISBN

0-7803-8155-6

Type

conf

DOI

10.1109/AERO.2004.1368049

Filename

1368049