• DocumentCode
    2110243
  • Title

    Enclosed Layout Transistor with Active Region Cutout

  • Author

    Binzaid, Shuza ; Attia, John O. ; Schrimpf, Ron D.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Prairie View A&M Univ., Prairie View, TX
  • fYear
    2008
  • fDate
    17-20 April 2008
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    An enclosed-layout-transistor (ELT) is modified using the active region cutout (ARC) technique. This transistor is called ARCELT. 3-D simulations were performed to obtain the leakage current with respect to radiation induced charge density, while keeping the layout dimensions and process parameters unchanged, for a standard nMOS transistor, the ELT and the ARCELT. The aspect ratio W/L of ARCELT was found to be smaller than ELT. It is shown that the ARCELT has radiation tolerance similar to that of ELT. The ARCELT can be configured as a triple electrode MOSFET device that can be used to design compound transistors. Two applications of ARCELT as a compound transistor are shown.
  • Keywords
    MOSFET; electrodes; leakage currents; radiation effects; semiconductor device models; 3-D simulations; ARCELT transistor; active region cutout technique; compound transistors; enclosed-layout-transistor; leakage current; nMOS transistor; radiation induced charge density; triple electrode MOSFET device; Computational modeling; Electrodes; Fabrication; Leakage current; MOSFET circuits; Nanoscale devices; Radiation effects; Region 3; Semiconductor devices; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Region 5 Conference, 2008 IEEE
  • Conference_Location
    Kansas City, MO
  • Print_ISBN
    978-1-4244-2076-6
  • Electronic_ISBN
    978-1-4244-2077-3
  • Type

    conf

  • DOI
    10.1109/TPSD.2008.4562742
  • Filename
    4562742