DocumentCode :
2111786
Title :
Multichannel optical coupling to a silicon photonics chip using a single-step bonding process
Author :
Soganci, Ibrahim Murat ; La Porta, Antonio ; Offrein, Bert Jan
Author_Institution :
IBM Res. - Zurich, Rüschlikon, Switzerland
fYear :
2013
fDate :
8-12 Sept. 2013
Firstpage :
115
Lastpage :
116
Abstract :
We report on scalable bidirectional optical coupling between silicon-on-insulator waveguides and polymer waveguides. Coupling loss of 0.8 dB and ±2 μm misalignment loss of 0.3 (0.6) dB are measured at TM (TE) polarization states.
Keywords :
bonding processes; integrated optoelectronics; optical couplers; optical losses; optical polymers; optical waveguides; silicon-on-insulator; Si; TE polarization state; TM polarization state; coupling loss; misalignment loss; multichannel optical coupling; polymer waveguides; scalable bidirectional optical coupling; silicon photonics chip; silicon-on-insulator waveguides; single-step bonding process; Couplers; Loss measurement; Optical coupling; Optical device fabrication; Optical losses; Optical waveguides; Polymers;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Photonics Conference (IPC), 2013 IEEE
Conference_Location :
Bellevue, WA
Print_ISBN :
978-1-4577-1506-8
Type :
conf
DOI :
10.1109/IPCon.2013.6656398
Filename :
6656398
Link To Document :
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