DocumentCode :
2111845
Title :
Life consumption monitoring for electronics prognostics
Author :
Mishra, Shivakant ; Ganesan, Sathyanarayan ; Pecht, Michael ; Xie, Jingsong
Author_Institution :
CALCE Electron. Products & Syst. Center, Maryland Univ., College Park, MD, USA
Volume :
5
fYear :
2004
fDate :
6-13 March 2004
Firstpage :
3455
Abstract :
Life consumption monitoring is a prognostic method to assess the remaining life of a product in its actual life-cycle environment by continuously or periodically measuring the product´s performance parameters and environmental conditions. This work discusses a generic process to conduct a life consumption monitoring for electronic products. Two case studies on a circuit card assembly in an automobile under-hood environment are presented as application examples of the process. Temperature and vibration were identified as the dominant factors for the failure of the circuit card assembly. The environmental loads were monitored using a data recorder and the remaining life of the card assembly was estimated using physics-of-failure based stress and damage models. The predicted remaining life of the circuit card assembly correlated well with the measurement results.
Keywords :
assembly planning; automotive electronics; electronic products; printed circuit testing; remaining life assessment; stress analysis; automobile under-hood environment; circuit card assembly; damage models; data recorder; electronics prognostics; environmental conditions; generic process; life consumption monitoring; life-cycle environment; physics-of-failure model; product life assessment; product performance parameters; remaining life assessment; stress models; temperature factor; vibration factor; Assembly; Automobiles; Circuits; Computer aided software engineering; Condition monitoring; Engines; Failure analysis; Life estimation; Performance analysis; Stress;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Aerospace Conference, 2004. Proceedings. 2004 IEEE
ISSN :
1095-323X
Print_ISBN :
0-7803-8155-6
Type :
conf
DOI :
10.1109/AERO.2004.1368151
Filename :
1368151
Link To Document :
بازگشت