• DocumentCode
    2111845
  • Title

    Life consumption monitoring for electronics prognostics

  • Author

    Mishra, Shivakant ; Ganesan, Sathyanarayan ; Pecht, Michael ; Xie, Jingsong

  • Author_Institution
    CALCE Electron. Products & Syst. Center, Maryland Univ., College Park, MD, USA
  • Volume
    5
  • fYear
    2004
  • fDate
    6-13 March 2004
  • Firstpage
    3455
  • Abstract
    Life consumption monitoring is a prognostic method to assess the remaining life of a product in its actual life-cycle environment by continuously or periodically measuring the product´s performance parameters and environmental conditions. This work discusses a generic process to conduct a life consumption monitoring for electronic products. Two case studies on a circuit card assembly in an automobile under-hood environment are presented as application examples of the process. Temperature and vibration were identified as the dominant factors for the failure of the circuit card assembly. The environmental loads were monitored using a data recorder and the remaining life of the card assembly was estimated using physics-of-failure based stress and damage models. The predicted remaining life of the circuit card assembly correlated well with the measurement results.
  • Keywords
    assembly planning; automotive electronics; electronic products; printed circuit testing; remaining life assessment; stress analysis; automobile under-hood environment; circuit card assembly; damage models; data recorder; electronics prognostics; environmental conditions; generic process; life consumption monitoring; life-cycle environment; physics-of-failure model; product life assessment; product performance parameters; remaining life assessment; stress models; temperature factor; vibration factor; Assembly; Automobiles; Circuits; Computer aided software engineering; Condition monitoring; Engines; Failure analysis; Life estimation; Performance analysis; Stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Aerospace Conference, 2004. Proceedings. 2004 IEEE
  • ISSN
    1095-323X
  • Print_ISBN
    0-7803-8155-6
  • Type

    conf

  • DOI
    10.1109/AERO.2004.1368151
  • Filename
    1368151