Title :
Modeling of the Fabrication and Operation of 3-D Self-Assembled SOI MEMS
Author :
Méndez, C. ; Louis, C. ; Paquay, S. ; De Vincenzo, P. ; Klapka, I. ; Rochus, V. ; Iker, F. ; André, N. ; Raskin, J.P.
Author_Institution :
Open Eng., Angleur
Abstract :
In this paper we present out-of-plane 3D self assembled SOI (silicon-on-insulator) MEMS that can be directly integrated to the electronic components. Because of their 3D nature, these structures can be used, for instance, as the basic elements for the construction of thermal actuators or flow sensors. We make a description of the fabrication and operation of these devices and we show how these two stages can be numerically simulated
Keywords :
micromechanical devices; self-assembly; silicon-on-insulator; 3D self-assembled SOI MEMS; electronic components; flow sensors; silicon-on-insulator; thermal actuators; Actuators; Fabrication; Mechanical sensors; Micromechanical devices; Numerical simulation; Shape; Silicon on insulator technology; Temperature; Thermal sensors; Thermal stresses;
Conference_Titel :
Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2006. EuroSime 2006. 7th International Conference on
Conference_Location :
Como
Print_ISBN :
1-4244-0275-1
DOI :
10.1109/ESIME.2006.1643957
