• DocumentCode
    2114686
  • Title

    Comparison of Si and GaN power devices used in PV module integrated converters

  • Author

    Acanski, M. ; Popovic-Gerber, J. ; Ferreira, J.A.

  • Author_Institution
    Electr. Sustainable Energy, Delft Univ. of Technol., Delft, Netherlands
  • fYear
    2011
  • fDate
    17-22 Sept. 2011
  • Firstpage
    1217
  • Lastpage
    1223
  • Abstract
    Using the newly developed enhancement-mode Galium-Nitride-on-Silicon (eGaN) devices with high conductivity and very fast switching speed a breakthrough in switching performance can be achieved. Multi-megahertz switching frequency capability will significantly reduce the size of passive components, adding the cost benefits and increasing the integration level and power density. As to date, the use of GaN devices in power converters is still in its infancy, but its widespread application is a near reality. PV converter industry is one of the areas which would greatly benefit from the new GaN technology. The most important requirements for a PV converter, efficiency and cost effectiveness, can both be addressed with improved switching devices. This paper presents a performance comparison of a PV module integrated DC-DC converter based on commercially available GaN and Si power devices. The presented results show that the first generation of GaN devices outperforms the best in class Si devices. Since GaN is immature technology, further improvements will be seen in the years to come.
  • Keywords
    DC-DC power convertors; III-V semiconductors; gallium compounds; silicon; wide band gap semiconductors; DC-DC converter; GaN; PV converter industry; PV module integrated converters; Si; cost effectiveness; integration level; multimegahertz switching frequency capability; power converters; power density; power devices; Gallium nitride; Inductance; Inductors; Performance evaluation; Silicon; Switches; Switching frequency;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Energy Conversion Congress and Exposition (ECCE), 2011 IEEE
  • Conference_Location
    Phoenix, AZ
  • Print_ISBN
    978-1-4577-0542-7
  • Type

    conf

  • DOI
    10.1109/ECCE.2011.6063915
  • Filename
    6063915