• DocumentCode
    2116347
  • Title

    High-performance capacitive microaccelerometer using large proof-mass and high-amplitude sense voltage

  • Author

    Yoo, Minwook ; Han, Ki-Ho

  • Author_Institution
    Sch. of Nano Eng., Inje Univ., Gimhae, South Korea
  • fYear
    2010
  • fDate
    1-4 Nov. 2010
  • Firstpage
    1787
  • Lastpage
    1790
  • Abstract
    We present a high-performance surface micromachined capacitive accelerometer, in which the mechanical noise was reduced by a large proof-mass (83.12 μg) and the electrical noise was decreased by a high-amplitude sense voltage (up to 12 Vpp). The proof-mass was increased by using a fabrication process involving anodic bonding of silicon and glass wafers, and by using a non-porous structure of the proof mass. In addition, by using a metal layer patterned on the glass substrate, the notch effect caused by deep RIE process was eliminated. Thereby the weight of the proof-mass could be further increased. The nonlinearity problem, caused by the high-amplitude sense voltage, was avoided using breached finger sensing electrodes. Experimental results showed that the total noise floor and the nonlinearity of the present microaccelerometer are 21.87 μG√Jm and 0.01534%, respectively.
  • Keywords
    accelerometers; capacitive sensors; micromachining; wafer bonding; anodic bonding; breached finger sensing electrodes; capacitive microaccelerometer; fabrication process; high-amplitude sense voltage; micromachining; non-porous structure; proof-mass;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Sensors, 2010 IEEE
  • Conference_Location
    Kona, HI
  • ISSN
    1930-0395
  • Print_ISBN
    978-1-4244-8170-5
  • Electronic_ISBN
    1930-0395
  • Type

    conf

  • DOI
    10.1109/ICSENS.2010.5689977
  • Filename
    5689977