Geometric Parameter Identification for Bulk-Micromachined Accelerometer from Modal Frequencies Measurements

Author

Michael, Steffen ; Katzschmann, Michael ; Hering, Siegfried

Author_Institution

Melexis GmbH, Erfurt

fYear

2006

fDate

24-26 April 2006

Firstpage

1

Lastpage

4

Abstract

A wafer-level testing method is investigated for an early stage of the manufacturing process applied to accelerometers. The approach consists of performing optical measurement of the modal responses of the MEMS structures, and uses this information in an inverse identification algorithm based on a FE model. Device characteristics can be determined by measured modal frequencies which are fed into a model based on the FE simulations. First measurements were done to validate the model and showed a good correlation between simulated and measured modal frequencies

Keywords

accelerometers; finite element analysis; manufacturing processes; micromachining; microsensors; MEMS structures; bulk-micromachined accelerometer; finite element simulation; geometric parameter identification; manufacturing process; modal frequencies measurements; optical measurement; wafer-level testing; Accelerometers; Frequency measurement; Geometrical optics; Iron; Manufacturing processes; Micromechanical devices; Parameter estimation; Performance evaluation; Semiconductor device modeling; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2006. EuroSime 2006. 7th International Conference on

Conference_Location

Como

Print_ISBN

1-4244-0275-1

Type

conf

DOI

10.1109/ESIME.2006.1644048

Filename

1644048