Title :
Geometric Parameter Identification for Bulk-Micromachined Accelerometer from Modal Frequencies Measurements
Author :
Michael, Steffen ; Katzschmann, Michael ; Hering, Siegfried
Author_Institution :
Melexis GmbH, Erfurt
Abstract :
A wafer-level testing method is investigated for an early stage of the manufacturing process applied to accelerometers. The approach consists of performing optical measurement of the modal responses of the MEMS structures, and uses this information in an inverse identification algorithm based on a FE model. Device characteristics can be determined by measured modal frequencies which are fed into a model based on the FE simulations. First measurements were done to validate the model and showed a good correlation between simulated and measured modal frequencies
Keywords :
accelerometers; finite element analysis; manufacturing processes; micromachining; microsensors; MEMS structures; bulk-micromachined accelerometer; finite element simulation; geometric parameter identification; manufacturing process; modal frequencies measurements; optical measurement; wafer-level testing; Accelerometers; Frequency measurement; Geometrical optics; Iron; Manufacturing processes; Micromechanical devices; Parameter estimation; Performance evaluation; Semiconductor device modeling; Testing;
Conference_Titel :
Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2006. EuroSime 2006. 7th International Conference on
Conference_Location :
Como
Print_ISBN :
1-4244-0275-1
DOI :
10.1109/ESIME.2006.1644048
