DocumentCode :
2123219
Title :
A general methodology of modelling 3D discontinuities using the TLM method
Author :
Boussetta, Chokri ; Ndagijimana, Fabien ; Chilo, Jean ; Saguet, Pierre
Author_Institution :
LEMO-INPG CNRS URA 833 BP. 257 38016 GRENOBLE Cedex France. Tel.: (33) 76.85.60.13, Fax: (33) 76.85.60.80
Volume :
2
fYear :
1994
fDate :
5-9 Sept. 1994
Firstpage :
1524
Lastpage :
1529
Abstract :
In this paper, we present a methodology for analysing interconnections in high speed logic devices using a full wave 3D technique. The 3D TLM method is used to compute in time domain the electromagnetic field in the structure. S-parameters of discontinuities are calculated from reflected and transmitted electromagnetic fields. An equivalent network of the discontinuity is extracted from the calculated S-parameters. This methodology is general and can be applied to any planar or 3D discontinuity, over a wide range of frequency. To illustrate its performance, results are presented for a microstrip right angle bend and a via up to 60 GHz.
Keywords :
Computational modeling; Electromagnetic fields; Electromagnetic propagation; Frequency domain analysis; Logic devices; Microstrip; Reflection; Scattering parameters; Transmission line matrix methods; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Conference, 1994. 24th European
Conference_Location :
Cannes, France
Type :
conf
DOI :
10.1109/EUMA.1994.337433
Filename :
4138479
Link To Document :
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