Title :
On package modelling
Author_Institution :
Research Institute for Telecommunications, H-1525 Budapest, POB 15, Hungary
Abstract :
Our purpose is twofold: to compare two frequently used circuits modelling MESFET and HEMT packages, and to outline a novel task description for optimizing circuit elements of the package model.
Keywords :
Circuit optimization; Electrical resistance measurement; HEMTs; MESFET circuits; Optimization methods; Packaging; Parameter extraction; Resonance; Scattering parameters; Semiconductor device measurement;
Conference_Titel :
Microwave Conference, 1994. 24th European
Conference_Location :
Cannes, France
DOI :
10.1109/EUMA.1994.337453
