Title :
Boundary scan testing combined with power supply current monitoring
Author :
Kärkkäinen, Matti ; Tiensyrjä, Kari ; Weissenfelt, Matti
Author_Institution :
Electron. Lab., Tech. Res. Centre of Finland, Oulu, Finland
fDate :
28 Feb-3 Mar 1994
Abstract :
The monitoring of power supply current is presented for detecting manufacturing defects in printed circuit boards. Simple and inexpensive test equipment consisting of PC and interface card has been developed to support current monitoring by utilizing IEEE 1149.1 standard test architecture
Keywords :
automatic test equipment; boundary scan testing; electric current measurement; fault location; microcomputer applications; peripheral interfaces; printed circuit testing; printed circuits; production testing; DFT rules; IDDq; IEEE 1149.1 standard test architecture; JTAG+ method; PC; boundary scan testing; bridging faults; interface card; manufacturing defects; power supply current monitoring; printed circuit boards; Assembly; CMOS technology; Circuit faults; Circuit testing; Current supplies; Logic testing; Monitoring; Power supplies; Printed circuits; Test equipment;
Conference_Titel :
European Design and Test Conference, 1994. EDAC, The European Conference on Design Automation. ETC European Test Conference. EUROASIC, The European Event in ASIC Design, Proceedings.
Conference_Location :
Paris
Print_ISBN :
0-8186-5410-4
DOI :
10.1109/EDTC.1994.326872
