Title :
In-phase resonant inductive coupling for multi-layer vertical communication in 3D-ICs
Author :
Han, Sangwook ; Wentzloff, David D.
Author_Institution :
Electr. Eng. & Comput. Sci. Dept., Univ. of Michigan, Ann Arbor, MI, USA
Abstract :
A signal boosting scheme for wireless inductive interconnects in 3D-ICs is proposed. It enables longer distance communication through multiple-stacked layers without increasing coil size by using in-phase resonant inductive coupling and regenerative oscillation. Measurement results show the received signal is improved by 16dB compared to a conventional standard inductive coupling method with and aspect ratio of 4:1.
Keywords :
coils; electromagnetic induction; integrated circuit interconnections; three-dimensional integrated circuits; 3D IC; coil size; distance communication; inphase resonant inductive coupling; multilayer vertical communication; multiple-stacked layers; regenerative oscillation; signal boosting scheme; wireless inductive interconnects; Boosting; Coils; Couplings; Oscillators; Resonant frequency; Silicon carbide; Wireless communication;
Conference_Titel :
Antennas and Propagation Society International Symposium (APSURSI), 2012 IEEE
Conference_Location :
Chicago, IL
Print_ISBN :
978-1-4673-0461-0
DOI :
10.1109/APS.2012.6347946
