DocumentCode :
2128810
Title :
Defect free assembly of SMT devices
Author :
Desai, Hasit
fYear :
1997
fDate :
22-25 Sep 1997
Firstpage :
677
Lastpage :
682
Abstract :
Process control is the only way to achieve defect free soldering. Soldering is a simple and repeatable process which is easily controllable. Inspection is less than 70% effective and cannot guarantee joint quality. Reworking and touch-up always reduces the life of solder joints. Inspection and reworking add nothing to the value of the product. A correctly set-up machine can never cause defective joints if PCBs and components are meeting solderability specifications. Solderability has a finite life usually of not more than six months. The PCB manufacturers shop is nothing but an extension to a manufacturing shop. Process control during bare PCB manufacturing results in good solder quality. Dewetting or nonwetting is usually caused by poor solderability of PCB or components. Blow holes indicate that there is a lack of control in a PCB fabrication process. Pin holes in solder joints indicates that the board manufacturer should review his drilling, hole cleaning and plating process. Touch up has no relation with reliability improvement of solder joints, it improves only cosmetics
Keywords :
printed circuit manufacture; soldering; surface mount technology; PCB fabrication process; SMT devices; blow holes; defect free assembly; defect free soldering; dewetting; inspection; nonwetting; pin holes; process control; reworking; solder joint life reduction; solderability specifications; touch-up;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Insulation Conference, 1997, and Electrical Manufacturing & Coil Winding Conference. Proceedings
Conference_Location :
Rosemont, IL
ISSN :
0362-2479
Print_ISBN :
0-7803-3959-2
Type :
conf
DOI :
10.1109/EEIC.1997.651278
Filename :
651278
Link To Document :
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