• DocumentCode
    2133458
  • Title

    Using MCD-DVS For Dynamic Thermal Management Performance Improvement

  • Author

    Chaparro, Pedro ; Magklis, Grigorios ; González, José ; González, Antonio

  • Author_Institution
    Intel Barcelona Res. Center, Intel Labs-UPC, Barcelona
  • fYear
    2006
  • fDate
    May 30 2006-June 2 2006
  • Firstpage
    140
  • Lastpage
    146
  • Abstract
    With chip temperature being a major hurdle in microprocessor design, techniques to recover the performance loss due to thermal emergency mechanisms are crucial in order to sustain performance growth. Many techniques for power reduction in the past and some on thermal management more recently have contributed to alleviate this problem. Probably the most important thermal control technique is dynamic voltage and frequency scaling (DVS) which allows for almost cubic reduction in power with worst-case performance penalty only linear. So far, DVS techniques for temperature control have been studied at the chip level. Finer grain DVS is feasible if a globally-asynchronous locally-synchronous (GALS) design style is employed. GALS, also known as multiple-clock domain (MCD), allows for an independent voltage and frequency control for each one of the clock domains that are part of the chip. There are several studies on DVS for GALS that aim to improve energy and power efficiency but not temperature. This paper proposes and analyses the usage of DVS at the domain level to control temperature in a clustered MCD microarchitecture with the goal of improving the performance of applications that do not meet the thermal constraints imposed by the designers
  • Keywords
    cooling; microprocessor chips; temperature control; thermal management (packaging); chip temperature; dynamic voltage scaling; globally-asynchronous locally-synchronous design; microprocessor design; multiple-clock domain; thermal constraints; thermal control; thermal emergency mechanisms; thermal management; Clocks; Disaster management; Dynamic voltage scaling; Energy management; Frequency control; Microprocessors; Performance loss; Temperature control; Thermal management; Voltage control;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on
  • Conference_Location
    San Diego, CA
  • ISSN
    1087-9870
  • Print_ISBN
    0-7803-9524-7
  • Type

    conf

  • DOI
    10.1109/ITHERM.2006.1645334
  • Filename
    1645334