Title :
Thermal Development, Modeling and Characterization of the Cell Processor Module
Author :
Wakil, J. ; Questad, D. ; Gaynes, Michael ; Hamann, Hendrik F. ; Weger, Alan ; Wang, Michael ; Harvey, P. ; Yarmchuk, E. ; Coffin, J. ; Yazawa, Kazuki ; Tamura, Takuya ; Takiguchi, I.
Author_Institution :
IBM Corp., Armonk, NY
fDate :
May 30 2006-June 2 2006
Abstract :
Optimal package thermal design for today´s high power processors is critical to meet demanding performance, cost, and reliability objectives. This paper describes the thermal characterization and development of the first generation CELL processor, developed jointly by Sony, Toshiba and IBM. The package not only provides the very high bandwidth necessary for electrical performance, but also achieves low thermal resistance to dissipate high power and maintain low die temperatures with superior reliability. The focus of the paper is the first level package. The target thermal resistance for the package is explained as determined from detailed 2nd level modeling and novel power map calculation and validation techniques are discussed. Thermal and mechanical modeling are used characterize the effects of the thermal interface material (TIM) on the thermal performance and mechanical response of the package. The thermal test strategy and the TIM characterization techniques are described. In summary, the paper describes the novel thermal modeling and characterization methodology used in the design process, allowing high heat flux in a low cost system application
Keywords :
integrated circuit packaging; integrated circuit reliability; thermal management (packaging); cell processor module; first level package; high power dissipation; low die temperature; mechanical modeling; optimal package thermal design; power map calculation; thermal characterization; thermal development; thermal interface material; thermal modeling; thermal resistance; thermal testing; Bandwidth; Character generation; Cost function; Electric resistance; Maintenance; Packaging; Process design; Temperature; Testing; Thermal resistance;
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-9524-7
DOI :
10.1109/ITHERM.2006.1645355