DocumentCode
2134136
Title
Thermal Optimization of a Radial Folded Fin Heat Sink for Desktop Computer Applications
Author
Dehoff, Bob ; Wang, Chong-Sheng ; Fast, David
Author_Institution
Tyco Electron., North Attleboro, MA
fYear
2006
fDate
May 30 2006-June 2 2006
Firstpage
341
Lastpage
344
Abstract
The continual development of faster desktop computers being sold at lower prices into the market place has demanded that thermal management engineers develop and optimize thermal management devices that not only perform better, but are at the same or lower cost than previous generations. The ever shrinking form factor has also increased the burden placed on today´s thermal management devices. CFD analysis was used to fully optimize, both cost and thermal performance, a radial folded fin heat sink design to solve today´s thermal management requirements. Modeling considerations and prototype test verifications are presented in determining the optimal thermal design characteristics, namely, fin density, fin thickness, fin style and core diameter
Keywords
computational fluid dynamics; heat conduction; heat sinks; microcomputers; thermal analysis; thermal management (packaging); CFD analysis; desktop computer applications; fin density; fin style; fin thickness; radial folded fin heat sink; thermal analysis; thermal management devices; thermal optimization; thermal resistance; Computational fluid dynamics; Computer applications; Cost function; Design optimization; Engineering management; Heat sinks; Performance analysis; Thermal engineering; Thermal factors; Thermal management;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on
Conference_Location
San Diego, CA
ISSN
1087-9870
Print_ISBN
0-7803-9524-7
Type
conf
DOI
10.1109/ITHERM.2006.1645362
Filename
1645362
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