• DocumentCode
    2134459
  • Title

    Gravity-assisted air mixing in data centers and how it affects the rack cooling effectiveness

  • Author

    Herrlin, Magnus K. ; Belady, Christian

  • Author_Institution
    ANCIS Inc., San Francisco, CA
  • fYear
    2006
  • fDate
    May 30 2006-June 2 2006
  • Lastpage
    438
  • Abstract
    As power and heat densities continue to increase, the behavior of the data-center environment grows in importance, especially when developing new in-room cooling technologies. As a result, there has been a continued interest in understanding the behavior of various technologies in data centers. One issue is whether gravity plays a role in air cooled high density environments with an open architecture. A previous paper (Herlin, 2005) suggests that technologies working with gravity perform better. This poses the question: Does gravity indeed play a key role in forced convection environments such as data centers? The purpose of the present paper is to try to answer this question by further analyzing what we call "gravity-assisted" air mixing. Computational fluid dynamics (CFD) modeling in conjunction with the rack cooling index (RCI) are used to demonstrate that such mixing is central to creating an adequate and "forgiving" thermal equipment environment. The paper also describes why this is an important finding for designing new high-performance cooling systems
  • Keywords
    air conditioning; computational fluid dynamics; computer centres; forced convection; thermal management (packaging); computational fluid dynamics; data centers; forced convection environments; gravity-assisted air mixing; high-performance cooling systems; in-room cooling technologies; open architecture; rack cooling effectiveness; rack cooling index; thermal equipment environment; Central office; Computational fluid dynamics; Electronic equipment; Electronics cooling; Gravity; Paper technology; Telecommunications; Thermal management; Thermal management of electronics; Water heating;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on
  • Conference_Location
    San Diego, CA
  • ISSN
    1087-9870
  • Print_ISBN
    0-7803-9524-7
  • Type

    conf

  • DOI
    10.1109/ITHERM.2006.1645375
  • Filename
    1645375