DocumentCode :
2135944
Title :
Key challenges for the piezo technology with applications to low form factor thermal solutions
Author :
Sauciuc, Ioan ; Moon, Sung-Won ; Chiu, Chia-Pin ; Chrysler, Greg ; Lee, Seri ; Paydar, Reza ; Walker, Maria ; Luke, Mark ; Mochizuki, Masataka ; Nguyen, Thang ; Eiji, Takenaka
Author_Institution :
Intel Corp., Chandler, AZ
fYear :
2006
fDate :
May 30 2006-June 2 2006
Lastpage :
785
Abstract :
The thermal performance of piezoelectric actuators for cooling in low form factor applications is presented. A significant reduction in thermal resistance is achievable when compared to the baseline natural convection. Comparisons with fans and blowers of similar size result in comparable performance but at greatly reduced power consumption
Keywords :
cooling; piezoelectric actuators; thermal management (packaging); electronics cooling; form factor; low noise cooling; natural convection; piezo blowers; piezo fans; piezoelectric actuators; piezotechnology; thermal performance; thermal resistance; Electronics cooling; Energy consumption; Fans; Immune system; Piezoelectric actuators; TV; Temperature; Thermal factors; Thermal management; Thermal resistance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on
Conference_Location :
San Diego, CA
ISSN :
1087-9870
Print_ISBN :
0-7803-9524-7
Type :
conf
DOI :
10.1109/ITHERM.2006.1645426
Filename :
1645426
Link To Document :
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