• DocumentCode
    2136647
  • Title

    Zero-bias resonant sensor with an oxide-nitride layer as charge trap

  • Author

    Park, Kwan Kyu ; Kupnik, Mario ; Lee, Hyunjoo J. ; Oralkan, Ömer ; Khuri-Yakub, Butrus T.

  • Author_Institution
    Edward L. Ginzton Lab., Stanford Univ., Stanford, CA, USA
  • fYear
    2010
  • fDate
    1-4 Nov. 2010
  • Firstpage
    1024
  • Lastpage
    1028
  • Abstract
    We report on a capacitive resonant sensor with an oxide-nitride (ON) layer used as charge trap. The main idea is that we intentionally inject charges into the ON layer by biasing the device for 30 s with 160% of the pull-in voltage. We use a capacitive micromachined ultrasonic transducer (CMUT) to demonstrate this idea. The CMUT is fabricated via high temperature assisted direct wafer bonding after a local oxidation of silicon (LOCOS) to form evacuated cavities (vacuum gaps), and, thus, the device inherently has the ON layer beneath single crystal silicon plates and vacuum gaps. Therefore, this device is ideal for this work. It allows us to test an elegant charge injection mechanism. By simply pulling in the plate a high electric field strength (~ 8.9 MV/cm) is created in the ON layer for a designated time, which results in charge injection. These charges stay trapped in the ON layer and create an intrinsic electric field in the vacuum gaps, which would otherwise require an external dc bias voltage of 44% of the pull-in voltage. We successfully implemented a 5.3-MHz oscillator with this zero bias resonator and achieved excellent noise performance of 0.06 Hz of Allan deviation.
  • Keywords
    capacitive sensors; charge injection; dielectric resonator oscillators; electric field measurement; oxygen compounds; silicon; ultrasonic transducers; wafer bonding; Allan deviation; JkO-JkN; Si; Zero-Bias Resonant Sensor; capacitive micromachined ultrasonic transducer; capacitive resonant sensor; charge injection mechanism; charge trap; dc bias voltage; electric field strength; frequency 0.06 Hz; frequency 5.3 MHz; local oxidation of silicon; single-crystal silicon plates; time 30 s; vacuum gaps; wafer bonding;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Sensors, 2010 IEEE
  • Conference_Location
    Kona, HI
  • ISSN
    1930-0395
  • Print_ISBN
    978-1-4244-8170-5
  • Electronic_ISBN
    1930-0395
  • Type

    conf

  • DOI
    10.1109/ICSENS.2010.5690742
  • Filename
    5690742