DocumentCode
2139126
Title
Step deposition and stabilizer interaction in electroless nickel bath for bond pad metallization
Author
Tiwari, Chandra ; Nguyen, Robert ; Phucas, Nick ; Teo, Bee Bee ; Steneck, Travis
Author_Institution
Micron Technol. Manassas, Manassas, VA, USA
fYear
2012
fDate
20-20 April 2012
Firstpage
1
Lastpage
4
Abstract
Stabilizers are key components of electroless nickel baths. Therefore, understanding the limitations and characteristics of stabilizers is very important for consistently achieving desired plating results. Higher concentrations of stabilizers cause defects like skip and step plating, whereas lower concentrations can lead to short bath life and bath decomposition. This paper studies the step deposition and stabilizer interaction on electroless nickel bath.
Keywords
electroless deposition; electroplating; metallisation; nickel; Ni; bath decomposition; bond pad metallization; electroless nickel bath; stabilizer interaction; step deposition; step plating; Chemicals; Copper; Metallization; Nickel; Stability criteria; Surface treatment; Electroless nickel; anisotropic deposition; bond pad; defects; skip plating; stabilizer; step plating;
fLanguage
English
Publisher
ieee
Conference_Titel
Microelectronics and Electron Devices (WMED), 2012 IEEE Workshop on
Conference_Location
Boise, ID
ISSN
1947-3834
Print_ISBN
978-1-4577-1735-2
Type
conf
DOI
10.1109/WMED.2012.6202617
Filename
6202617
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