• DocumentCode
    2139139
  • Title

    3D Active Modules for High Integration Active Antennas

  • Author

    Ulian, Patrice ; Monfraix, Philippe ; George, Sebastien ; Tronche, Christian ; Drevon, Claude ; Cazaux, Jean-Louis

  • Author_Institution
    ALCATEL SPACE, 26 avenue J-F Champollion, 31037 TOULOUSE, FRANCE
  • Volume
    1
  • fYear
    1998
  • fDate
    Oct. 1998
  • Firstpage
    271
  • Lastpage
    276
  • Abstract
    This paper describes the different parts of active antenna sub-systems currently developed in Alcatel Espace. These modules are realized according to some new 3D RF packaging technologies, mainly based on moulding assembly.
  • Keywords
    Aerospace industry; Antenna measurements; Assembly; Dielectric loss measurement; Integrated circuit interconnections; Low earth orbit satellites; Radio frequency; Space technology; Vehicles; Wideband;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Conference, 1998. 28th European
  • Conference_Location
    Amsterdam, Netherlands
  • Type

    conf

  • DOI
    10.1109/EUMA.1998.337999
  • Filename
    4139086
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2139139