3D-SIP integration for autonomous sensor nodes

Author

Stoukatch, Serguei ; Winters, Christophe ; Beyne, Eric ; De Raedt, Walter ; Van Hoof, Chris

Author_Institution

IMEC, Leuven

fYear

0

fDate

0-0 0

Abstract

This paper presents details of a 3D-SIP approach. It involves a package-on-package system level integration method that leads to a 3D stack where the different layers are individual sub-system SIP circuit blocks. By using this approach, the required number of connections between the SIP packages is greatly reduced. A SIP also offers sufficient 3D-interconnect density between the functional layers. Using a 3D SIP approach of integration, a wireless bio-electronic sensor node was realized. This system includes a low-power radio, a matched antenna, a microcontroller with a 12 bit ADC, crystal oscillators, all necessary passives and a custom designed EEG ASIC. The currently demonstrated device is a portable, electroencephalogram (EEG) system for brain activity monitoring

Keywords

application specific integrated circuits; electric sensing devices; integrated circuit interconnections; system-in-package; 12 bit; 3D-SIP integration; 3D-interconnect density; ADC; EEG ASIC; autonomous sensor nodes; bio-electronic sensor node; brain activity monitoring; circuit blocks; crystal oscillators; electroencephalogram system; low-power radio; matched antenna; microcontroller; wireless sensor node; Application specific integrated circuits; Biosensors; Brain; Dipole antennas; Electroencephalography; Electronic components; Microcontrollers; Packaging; Transceivers; Wireless sensor networks;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2006. Proceedings. 56th

Conference_Location

San Diego, CA

ISSN

0569-5503

Print_ISBN

1-4244-0152-6

Type

conf

DOI

10.1109/ECTC.2006.1645678

Filename

1645678