Ultra high conductivity of isotropic conductive adhesives

Author

Jiang, Hongjin ; Moon, Kyoung-Sik ; Li, Yi ; Wong, C.P.

Author_Institution

Sch. of Mater. Sci. & Eng., Georgia Inst. of Technol., Atlanta, GA

fYear

0

fDate

0-0 0

Abstract

Electrical properties of the isotropic conductive adhesives filled with micron sized silver flakes and nanosized silver particles were investigated. By using appropriate surfactants, the resistivity of the silver flakes and silver nanoparticles incorporated conductive adhesives was dramatically reduced to as low as 5 times 10-6 Omega.cm. Morphology studies showed that the decreased resistivity resulted from the sintering of silver nanoparticles. The contact resistance of the conductive adhesives under 85degC/85%RH was significantly stable with respect to aging time due to the further sintering of silver nanoparticles

Keywords

adhesives; composite materials; conducting polymers; electrical conductivity; nanoparticles; silver alloys; surfactants; contact resistance; electrical properties; isotropic conductive adhesives; micron sized silver flakes; silver nanoparticles; surfactants; ultra high conductivity; Chemicals; Conductive adhesives; Conductivity; Contact resistance; Lead; Nanoparticles; Polymers; Silver; Surface morphology; Tin;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2006. Proceedings. 56th

Conference_Location

San Diego, CA

ISSN

0569-5503

Print_ISBN

1-4244-0152-6

Type

conf

DOI

10.1109/ECTC.2006.1645691

Filename

1645691