Rational function fitting of electromagnetic transfer functions of interconnect structures via extrapolation in time and interpolation in frequency

Author

Moon, Se-Jung ; Cangellaris, Andreas C.

Author_Institution

Dept. of Electr. & Comput. Eng., Illinois Univ. at Urbana-Champaign, Urbana, IL

fYear

0

fDate

0-0 0

Abstract

A new methodology is proposed for the rational function fitting of transfer functions of passive electromagnetic devices from numerically obtained and/or measured frequency-domain and time-domain response data. The proposed methodology combines the frequency-domain vector fitting process VECTFIT with its time-domain analog TDVF to yield a robust and versatile fitting algorithm for producing a rational function, broadband fit of the device response. The accuracy of the resulting algorithm is demonstrated through its application to the fitting of the admittance matrix of a lossy multi-conductor transmission line system

Keywords

electromagnetic devices; extrapolation; frequency-domain analysis; integrated circuit interconnections; interpolation; passive networks; rational functions; time-domain analysis; transfer functions; admittance matrix; electromagnetic transfer functions; frequency interpolation; frequency-domain response data; frequency-domain vector fitting; interconnect structures; lossy multiconductor transmission line system; passive electromagnetic devices; rational function fitting; robust fitting algorithm; time extrapolation; time-domain analog vector fitting; time-domain response data; Admittance; Electromagnetic devices; Electromagnetic measurements; Extrapolation; Frequency measurement; Interpolation; Robustness; Time domain analysis; Transfer functions; Transmission line matrix methods;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2006. Proceedings. 56th

Conference_Location

San Diego, CA

ISSN

0569-5503

Print_ISBN

1-4244-0152-6

Type

conf

DOI

10.1109/ECTC.2006.1645813

Filename

1645813