The scalable modeling of multi-layer embedded capacitor based on LTCC substrate

Author

Park, Jongbae ; Lu, Albert Chee W ; Fan, Wei ; Wai, Lai L. ; Chua, Kai M. ; Shim, Yujeong ; Kim, Joungho

Author_Institution

Dept. of Electr. Eng. & Comput. Sci., Korea Adv. Inst. of Sci. & Technol., Daejon

fYear

0

fDate

0-0 0

Abstract

Low temperature co-fired ceramic (LTCC) technology is the preferred platform for integrating multi-layer capacitors due to excellent high frequency performance and low-loss dielectric properties. This letter describes an approach to perform modeling of multi-layer capacitors in LTCC technology. This hybrid approach combines both analytical modeling and numerical modeling to provide a scalable circuit model predicting the self-resonance frequency of the multiple dielectric and electrode layers. Good correlation between the simulation results and network analyzer measurements has been also achieved

Keywords

ceramic capacitors; ceramic packaging; dielectric materials; integrated circuit modelling; resonance; substrates; LTCC substrate; dielectric properties; hybrid approach; multilayer embedded capacitor; network analyzer measurements; scalable circuit model; self-resonance frequency; Analytical models; Capacitors; Ceramics; Circuits; Dielectric substrates; Electrodes; Frequency; Numerical models; Predictive models; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2006. Proceedings. 56th

Conference_Location

San Diego, CA

ISSN

0569-5503

Print_ISBN

1-4244-0152-6

Type

conf

DOI

10.1109/ECTC.2006.1645819

Filename

1645819