DocumentCode
2145487
Title
Millimeter-wave Transceiver MCM Usig Multi-layer BCB with Integrated Planner Antenna
Author
Fujita, Suguru ; Sangawa, Ushio ; Takahashi, Kazuaki ; Goho, Kenji ; Takeyama, Shigeru ; Ogura, Hiroshi ; Yabuki, Hiroyuki
Author_Institution
Matsushita Research Institute Tokyo, Inc., 3-10-1, Higashimita, Tama-ku, Kawasaki 214-8501, Japan, E-mail: sfujita@mrit.mei.co.jp
Volume
1
fYear
1999
fDate
Oct. 1999
Firstpage
91
Lastpage
94
Abstract
A novel millimeter-wave transceiver MCM using multi-layer BCB was proposed. This MCM is based on a glass substrate laminated with three layers of BCB thin film, enabling four-layer 3-D circuitry. We report two different Ka-band MCMs of this structure; namely, a flip-chip assembled 28 GHz transceiver MCM integrating four MMICs of independent functions, and a 38 GHz receiver MCM with built-in four-element slot antenna array and flip-chip assembled MMIC.
Keywords
Antenna arrays; Assembly; Glass; MMICs; Millimeter wave integrated circuits; Receiving antennas; Slot antennas; Substrates; Thin film circuits; Transceivers;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Conference, 1999. 29th European
Conference_Location
Munich, Germany
Type
conf
DOI
10.1109/EUMA.1999.338348
Filename
4139375
Link To Document