• DocumentCode
    2145709
  • Title

    Growth and characterization of Si/SiN/SiC structures by APCVD process

  • Author

    Yang, Yin-tang ; Jia, Hu-Jun ; Chai, Chang-Chun ; Li, Yue-jin

  • Author_Institution
    Key Lab. of Educ. Minist. for WBG Semicond. Mater. & Devices, Xidian Univ., Xi´´an, China
  • fYear
    2008
  • fDate
    20-23 Oct. 2008
  • Firstpage
    730
  • Lastpage
    733
  • Abstract
    Polycrystal 3C-SiC films have been grown on Si/SiN structures via atmospheric pressure chemical vapor deposition (APCVD) process with a SiH4-C3H8-H2 reaction gas system. The change of SiN microstructure during high temperature pretreatment, and its effect on the crystallinities of SiC growth films were measured using SEM and XRD. Experiment results show that high temperature pretreatment of substrates¿ surface lead to a change of SiN from poly-crystal to quasi-crystal. The crystallized surface of SiN prevent the forming of Si-C bonding and growth of SiC films. This change can be controlled with a lower growth temperature and then a poly SiC films preferential orientation grown along <111> direction is obtained contained some poly-silicon grains.
  • Keywords
    X-ray diffraction; chemical vapour deposition; elemental semiconductors; quasicrystals; scanning electron microscopy; semiconductor growth; semiconductor thin films; silicon; silicon compounds; texture; wide band gap semiconductors; APCVD process; SEM; Si-SiC-SiN; XRD; atmospheric pressure chemical vapor deposition; crystallinity; gas system reaction; growth films; high-temperature pretreatment; microstructure; poly-silicon grains; polycrystal films; preferential orientation growth; quasicrystals; Atomic measurements; Chemical vapor deposition; Crystallization; Hydrogen; Insulation; Semiconductor films; Silicon carbide; Silicon compounds; Substrates; Temperature; APCVD; CVD; films; poly-crystal SiC;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State and Integrated-Circuit Technology, 2008. ICSICT 2008. 9th International Conference on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4244-2185-5
  • Electronic_ISBN
    978-1-4244-2186-2
  • Type

    conf

  • DOI
    10.1109/ICSICT.2008.4734635
  • Filename
    4734635