DocumentCode
2146137
Title
Fabrication and characteristics of 40 Gb/s traveling-wave electroabsorption modulator-integrated DFB laser modules
Author
Yun, Ho-Gyeong ; Choi, Kwang-Seong ; Kwon, Yong-Hwan ; Choe, Joong-Seon ; Moon, Jong-Tae
Author_Institution
IT Convergence & Components Lab., Electron. & Telecommun. Res. Inst., Daejeon
fYear
0
fDate
0-0 0
Abstract
We developed 40 Gb/s traveling wave electroabsorption modulator-integrated DFB laser (TW-EML) modules using several advanced technologies. This 40 Gb/s EML device adopted traveling wave electrode structures and showed the result that the measured 3 dB bandwidth of the electrical-to-optical (E/O) response reached about 45 GHz and the return loss (S11) was kept below -10 dB up to 50 GHz. For the module designs of this device, electrical and optical factors were mainly considered. The measured S11 of the fabricated 40 Gb/s TW-EML module was maintained below -10 dB up to about 30 GHz and the 3 dB bandwidth of the E/O response reached over 35 GHz. We also developed two types of CPW for the application of the driver amplifier integrated 40 Gb/s TW-EML module, which is a system-on-package (SoP) composed of a EML device and a driver amplifier device in a module. The measured S11 of the two-step-bended CPW was kept below -10 dB up to 35 GHz and the measured S11 of the parallel type coplanar waveguide (CPW) was kept below -10 dB up to 39 GHz
Keywords
coplanar waveguides; distributed feedback lasers; electro-optical modulation; electroabsorption; system-in-package; travelling wave amplifiers; 40 Gbit/s; CPW; DFB laser modules; EML device; SoP; TW-EML modules; coplanar waveguide; driver amplifier device; electrical-to-optical response; return loss; system-on-package; traveling wave electrode structures; traveling-wave electroabsorption modulator; Bandwidth; Coplanar waveguides; Driver circuits; Electric variables measurement; Electrodes; Loss measurement; Optical amplifiers; Optical device fabrication; Optical devices; Optical losses;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2006. Proceedings. 56th
Conference_Location
San Diego, CA
ISSN
0569-5503
Print_ISBN
1-4244-0152-6
Type
conf
DOI
10.1109/ECTC.2006.1645885
Filename
1645885
Link To Document