Title :
Parallelized computational technique for signal propagation analysis at very high speed differential transmission lines
Author :
Li, Er Ping ; Jin, Hing Fang ; Yuan, Wei Liang ; Li, LeWei
Author_Institution :
Inst. of High Performance Comput., Science Park II, Singapore
Abstract :
To efficiently and accurately predict and simulate the signal propagation for very high speed (10 GHz above), high density and even multilayer boards, the fast full wave numerical techniques have to be employed. However, it consequently needs very large computing capacity and resources which not every electronic design firm can afford. This paper presents the implementation of the parallel computing method in the full wave FDTD and the simulation of signal integrity with high frequency. The computing method could be employed in such a way that numbers of PC´s are networked as PC-cluster parallel computing which are affordable to any of the companies. Moreover, the paper illustrates the simulation of signal propagation characteristics in the very high speed differential signal transmission lines by using our specially developed parallelized finite-difference time-domain (FDTD) algorithm. The crosstalk and reflection between the traces is simulated with the different geometry parameters. The efficiency by using parallel computing method is highlighted in the paper.
Keywords :
crosstalk; finite difference time-domain analysis; parallel processing; transmission lines; PC-cluster parallel computing; crosstalk; finite-difference time-domain; full wave FDTD; high speed differential transmission lines; multilayer board; parallel computing method; parallelized FDTD algorithm; parallelized computational technique; reflection; signal integrity simulation; signal propagation analysis; Computational modeling; Concurrent computing; Finite difference methods; Frequency; Nonhomogeneous media; Parallel processing; Predictive models; Signal analysis; Time domain analysis; Transmission lines;
Conference_Titel :
Electromagnetic Compatibility, 2003 IEEE International Symposium on
Print_ISBN :
0-7803-7835-0
DOI :
10.1109/ISEMC.2003.1236719