High performance system-on-package integrated Yagi-Uda antennas for W-band applications and mm-wave ultra-wideband data links

Author

Pan, B. ; DeJean, G. ; Papapolymerou, J. ; Tentzeris, M.M. ; Yoon, Y. ; Allen, M.G.

Author_Institution

Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA

fYear

0

fDate

0-0 0

Abstract

This paper reports two system-on-package (SoP) integration schemes for utilizing the Yagi-Uda antenna in the RF/microwave/millimeter wave applications. A substrate independent W-band vertical Yagi-Uda was fabricated and characterized. It shows a forward gain of 5.3 dBi and a front-to-back ratio of 6 dB and has proven the feasibility of using the surface micromachining technology into SoP integration. A compact mm-wave printed Yagi array is also reported for the first time with a 12.0 dBi gain achieved

Keywords

Yagi antenna arrays; micromachining; microstrip antenna arrays; microwave antenna arrays; millimetre wave antenna arrays; system-in-package; ultra wideband antennas; SoP integration schemes; W-band applications; W-band vertical Yagi-Uda; Yagi-Uda antennas; millimetre wave ultra-wideband data links; mm-wave printed Yagi array; surface micromachining technology; system-on-package; Antennas and propagation; Application software; Micromachining; Microstrip antenna arrays; Microwave antennas; Millimeter wave technology; Radio frequency; Ultra wideband antennas; Ultra wideband technology; Yagi-Uda antennas;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2006. Proceedings. 56th

Conference_Location

San Diego, CA

ISSN

0569-5503

Print_ISBN

1-4244-0152-6

Type

conf

DOI

10.1109/ECTC.2006.1645889

Filename

1645889