• DocumentCode
    2148240
  • Title

    Improved performance of 3D tri-gate 4H-SiC MESFETs with recessed drift region

  • Author

    Zhang, Jinping ; Zhang, Bo ; Li, Zhaoji

  • Author_Institution
    State key Lab. of Electron. Thin Films & Integrated Devices, Univ. of Electron. Sci. & Technol. of China, Chengdu, China
  • fYear
    2008
  • fDate
    20-23 Oct. 2008
  • Firstpage
    1098
  • Lastpage
    1101
  • Abstract
    An improved 3D tri-gate 4H-SiC MESFETs structure with recessed drift region was proposed. The recessed drift region of the proposed structure is to reduce the channel thickness between gate and drain to increase breakdown voltage as well as to eliminate gate depletion layer extension to source/drain to decrease gate-source capacitance. The DC and RF electrical characteristics of the proposed structure were studied in detail by numerical simulation. The simulated results showed that the maximum theoretical output power density of the proposed structure is about 19% larger than that of the published 3D tri-gate structure. The cut-off frequency (fT) and the maximum oscillation frequency (fmax) of the proposed structure are 19.3 GHz and 74.1 GHz compared to 16.1 GHz and 55.9 GHz of those of the published 3D tri-gate structure, respectively.
  • Keywords
    Schottky gate field effect transistors; numerical analysis; semiconductor device breakdown; semiconductor device models; silicon compounds; wide band gap semiconductors; 3D tri-gate 4H-SiC MESFET; 3D tri-gate structure; DC electrical characteristics; RF electrical characteristics; SiC; breakdown voltage; channel thickness; cut-off frequency; frequency 16.1 GHz; frequency 19.3 GHz; frequency 55.9 GHz; frequency 74.1 GHz; gate depletion layer extension; gate-source capacitance; maximum oscillation frequency; numerical simulation; recessed drift region; Capacitance; Cutoff frequency; Doping; Laboratories; MESFETs; Radio frequency; Silicon carbide; Strips; Thermal conductivity; Thin film devices;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State and Integrated-Circuit Technology, 2008. ICSICT 2008. 9th International Conference on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4244-2185-5
  • Electronic_ISBN
    978-1-4244-2186-2
  • Type

    conf

  • DOI
    10.1109/ICSICT.2008.4734743
  • Filename
    4734743