DocumentCode
2148374
Title
Single wafer all-wet photo resist strip process for LDD implant in CMOS technology
Author
Bonfanti, Paolo ; Sellmer, Reinhard ; Liu, Glen ; He, Youfeng ; Hao, Liu ; Henry, Sally-Ann ; Deutschmann, Lutz ; Archer, Leo
Author_Institution
SMIC, Beijing, China
fYear
2008
fDate
20-23 Oct. 2008
Firstpage
1177
Lastpage
1179
Abstract
This paper reports the comparison between conventional ash followed by wet bench process approach and the new all wet process for LDD implant application. The comparison covers the areas of defect performance, (material loss, electrical data, yield) and chemical consumption.
Keywords
CMOS integrated circuits; photoresists; CMOS technology; LDD implant; single wafer all-wet photo resist strip process; CMOS process; CMOS technology; Chemicals; Cleaning; Implants; Performance loss; Resists; Strips; Substrates; Thickness control;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State and Integrated-Circuit Technology, 2008. ICSICT 2008. 9th International Conference on
Conference_Location
Beijing
Print_ISBN
978-1-4244-2185-5
Electronic_ISBN
978-1-4244-2186-2
Type
conf
DOI
10.1109/ICSICT.2008.4734748
Filename
4734748
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