DocumentCode
2149129
Title
Impact of statistical variability and charge trapping on 14 nm SOI FinFET SRAM cell stability
Author
Xingsheng Wang ; Binjie Cheng ; Brown, A.R. ; Millar, C. ; Kuang, Jente B. ; Nassif, S. ; Asenov, Asen
Author_Institution
Device Modelling Group, Univ. of Glasgow, Glasgow, UK
fYear
2013
fDate
16-20 Sept. 2013
Firstpage
234
Lastpage
237
Abstract
Variability is a critical concern for the stability and yield of SRAM with minimized size. We present a study of a 14 nm node SOI FinFET SRAM cell under the influence of statistical variability and random charge trapping due to positive/negative bias temperature instability (P/NBTI). Low channel doping is believed to be one of the main advantages of FinFETs in reducing statistical variability, but fin and gate edge roughness and metal gate granularity can cause significant variability and affect SRAM stability. The noise margins are largely skewed, and read and write noise margins are decorrelated due to statistical variability. Under heavy stress conditions cell read noise margin can be degraded by 30mV on average due to charge trapping, and its 6σ-yield becomes even worse due to the enhanced variability in N/PBTI.
Keywords
MOSFET circuits; SRAM chips; integrated circuit modelling; negative bias temperature instability; semiconductor doping; silicon-on-insulator; statistical analysis; FinFET SRAM cell stability; P/NBTI; SOI; channel doping; charge trapping; fin edge roughness; gate edge roughness; metal gate granularity; noise margins; positive/negative bias temperature instability; silicon-on-insulator; size 14 nm; statistical variability; Charge carrier processes; FinFETs; Logic gates; Noise; SRAM cells; Stress;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Device Research Conference (ESSDERC), 2013 Proceedings of the European
Conference_Location
Bucharest
Type
conf
DOI
10.1109/ESSDERC.2013.6818862
Filename
6818862
Link To Document