Title :
A New Low Cost Packaging Technique for SMT Insertion of Millimeter MMICs
Author_Institution :
Thomson - CSF Communications, 66, rue du Fossé Blanc. BP 136. 92231 Gennevilliers Cedex, France. eMail: gerard.cachier@tcc.thomson-csf.com
Abstract :
The newly developed package "MUSE" has a low insertion loss, and is free of any parasitic resonance up to around 50 Ghz. It enables low cost SMT insertion of millimeter MMICs on microwave PC boards, together with the non-microwave components.
Keywords :
Bonding; Costs; MMICs; Microstrip; Microwave devices; Packaging machines; Protection; Resonance; Semiconductor device measurement; Surface-mount technology;
Conference_Titel :
Microwave Conference, 1999. 29th European
Conference_Location :
Munich, Germany
DOI :
10.1109/EUMA.1999.338473
