Title :
Optical and electrical properties of InN grown by radio-frequency sputtering
Author :
Wintrebert-Fouquet, M. ; Butcher, K.S.A. ; Motlan
Author_Institution :
Dept. of Phys., Macquarie Univ., Sydney, NSW, Australia
Abstract :
InN is now one of the hottest materials in the world. Interest stems from the potential for the development of the next generation of mobile communication hardware. International research is increased dramatically, however Australia remains a pioneering research force in this area. In this paper, we present our latest results on the optical and electrical characterisation of InN thin films prepared by RF reactive sputtering of an In target with pure nitrogen gas. A new aspect of target conditioning is identified as an important growth parameter. A series of samples were grown with different thickness under optimized growth conditions. Films were characterised by X-ray diffraction, atomic force microscopy and Hall measurements. Optical measurements show that films have band gap values close to 2 eV. A comparative study of the optical and electrical properties is reported after removing 100 to 200 nm of the film surface by reactive ion etching.
Keywords :
Hall effect; III-V semiconductors; X-ray diffraction; atomic force microscopy; energy gap; indium compounds; optical films; optical variables measurement; semiconductor growth; semiconductor thin films; sputter deposition; sputter etching; wide band gap semiconductors; 100 to 200 nm; Australia; Hall measurements; In target; InN; X-ray diffraction; atomic force microscopy; band gap; electrical properties; growth parameter; mobile communication hardware; optical measurements; optical properties; optimized growth conditions; pure nitrogen gas; radio-frequency sputtering; reactive ion etching; thin films; Atom optics; Atomic force microscopy; Atomic measurements; Force measurement; Mobile communication; Optical films; Optical materials; Particle beam optics; Radio frequency; Sputtering;
Conference_Titel :
Optoelectronic and Microelectronic Materials and Devices, 2002 Conference on
Print_ISBN :
0-7803-7571-8
DOI :
10.1109/COMMAD.2002.1237198