• DocumentCode
    21545
  • Title

    Fabrication of a Monolithic Array of Three Dimensional Si-based Ion Traps

  • Author

    See, Patrick ; Wilpers, Guido ; Gill, P. ; Sinclair, A.G.

  • Author_Institution
    Nat. Phys. Lab., Teddington, UK
  • Volume
    22
  • Issue
    5
  • fYear
    2013
  • fDate
    Oct. 2013
  • Firstpage
    1180
  • Lastpage
    1189
  • Abstract
    Segmented linear ion trap arrays are versatile devices that are increasingly used to study quantum physics and demonstrate the fundamental principles of quantum information processing. Traps with three-dimensional (3-D) electrode geometries can create a superior confining potential for ions. However, the realization of a monolithic 3-D microchip trap with scalable fabrication technology remains challenging. In this paper the microfabrication of a monolithic array of 3-D ion microtraps in a semiconductor chip is presented. The electrode structure is formed by micromachining a silica-on-silicon wafer and metallizing the dielectric with gold. The fabrication method uses conventional semiconductor wafer processing tools and techniques. The specific operating characteristics which demonstrate the suitability of the chosen material system and fabrication process are presented.
  • Keywords
    electrodes; micromachining; particle traps; silicon radiation detectors; silicon-on-insulator; 3D Si-based ion traps; 3D electrode geometries; 3D ion microtraps; Si-SiO2; confining potential; electrode structure; fabrication method; fabrication process; material system; microfabrication; micromachining; monolithic 3D microchip trap; monolithic array; quantum information processing; quantum physics; scalable fabrication technology; segmented linear ion trap arrays; semiconductor chip; semiconductor wafer processing tools; silica-on-silicon wafer; Ion trap; microelectromechanical systems; quantum information processing; semiconductor devices;
  • fLanguage
    English
  • Journal_Title
    Microelectromechanical Systems, Journal of
  • Publisher
    ieee
  • ISSN
    1057-7157
  • Type

    jour

  • DOI
    10.1109/JMEMS.2013.2262573
  • Filename
    6552978