DocumentCode
2155108
Title
The effect of implantation damage on arsenic/phosphorus codiffusion
Author
Law, M.E. ; Pfiester, J.R. ; Dutton, R.W.
Author_Institution
Integrated Circuit Lab., Stanford Univ., CA, USA
fYear
1988
fDate
11-14 Dec. 1988
Firstpage
640
Lastpage
643
Abstract
Experiments and simulations have been performed which indicate three important effects of implantation damage on arsenic-phosphorus codiffusion. First, the profiles are primarily determined by the damage-induced injection of defects. Second, damage enhancement is independent of anneal time. Third, the effect of the damage from the phosphorus implant is as important as the arsenic implant damage. It is concluded that the modeling of these effects is critical for accurate LDD (lightly doped drain) device design.<>
Keywords
annealing; elemental semiconductors; ion implantation; silicon; LDD device design; anneal time; damage enhancement; damage-induced injection of defects; effects of implantation damage; lightly doped drain; Annealing; Equations; Fabrication; Impurities; Kinetic theory; Laboratories; MOS devices; Modems; Oxidation; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 1988. IEDM '88. Technical Digest., International
Conference_Location
San Francisco, CA, USA
ISSN
0163-1918
Type
conf
DOI
10.1109/IEDM.1988.32895
Filename
32895
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