• DocumentCode
    2155108
  • Title

    The effect of implantation damage on arsenic/phosphorus codiffusion

  • Author

    Law, M.E. ; Pfiester, J.R. ; Dutton, R.W.

  • Author_Institution
    Integrated Circuit Lab., Stanford Univ., CA, USA
  • fYear
    1988
  • fDate
    11-14 Dec. 1988
  • Firstpage
    640
  • Lastpage
    643
  • Abstract
    Experiments and simulations have been performed which indicate three important effects of implantation damage on arsenic-phosphorus codiffusion. First, the profiles are primarily determined by the damage-induced injection of defects. Second, damage enhancement is independent of anneal time. Third, the effect of the damage from the phosphorus implant is as important as the arsenic implant damage. It is concluded that the modeling of these effects is critical for accurate LDD (lightly doped drain) device design.<>
  • Keywords
    annealing; elemental semiconductors; ion implantation; silicon; LDD device design; anneal time; damage enhancement; damage-induced injection of defects; effects of implantation damage; lightly doped drain; Annealing; Equations; Fabrication; Impurities; Kinetic theory; Laboratories; MOS devices; Modems; Oxidation; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 1988. IEDM '88. Technical Digest., International
  • Conference_Location
    San Francisco, CA, USA
  • ISSN
    0163-1918
  • Type

    conf

  • DOI
    10.1109/IEDM.1988.32895
  • Filename
    32895