DocumentCode
2155409
Title
Broadband dual-via architectures for multilayer PCB signal injection and intra-layer transition
Author
Metz, Carsten ; Baras, Torben ; Lyons, Alan
Author_Institution
Bell Labs., Lucent Technol., Murray Hill, NJ, USA
fYear
2005
fDate
12-17 June 2005
Abstract
In this paper two transmission line architectures for intra-layer transitions in multilayer printed circuit boards (PCBs) are presented. Based on a balanced power divider and combiner concept, these can significantly improve the broadband transmission behavior for transmission rates beyond 10GB/s. The electrical performance for state-of-the-art PCBs is reviewed, and compared to the approach by means of simulations and measurements.
Keywords
microstrip transitions; power combiners; power dividers; printed circuit design; balanced power divider; broadband dual-via architectures; broadband transmission behavior; electrical performance; intra-layer transition; multilayer PCB; multilayer printed circuit boards; power combiner; signal injection; state-of-the-art PCB; stub resonance; transmission line architectures; Backplanes; Dielectric substrates; Distributed parameter circuits; Frequency; High speed optical techniques; Nonhomogeneous media; Power transmission lines; Printed circuits; Resonance; Stripline;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest, 2005 IEEE MTT-S International
ISSN
01490-645X
Print_ISBN
0-7803-8845-3
Type
conf
DOI
10.1109/MWSYM.2005.1516752
Filename
1516752
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