Title :
Analysis of RLC interconnect delay considering thermal effect
Author :
Dong, Gang ; Leng, Peng ; Yang, Yintang ; Chai, Changchun
Author_Institution :
Inst. of Microelectron., Xidian Univ., Xi´´an, China
Abstract :
Based on the equivalent Elmore delay model, a new delay model that takes inductance and thermal effect into consideration is presented in this paper. The proposed model with high efficiency has closed-form expression. Its solution exhibits high accuracy as compared to the other models. Simulation results show that the error in the propagation delay is less than 10% for RLC tree example.
Keywords :
RLC circuits; delay circuits; delays; equivalent circuits; inductance; interconnections; network analysis; trees (mathematics); RLC tree; equivalent Elmore delay model; inductance; interconnect delay; thermal effect; Closed-form solution; Delay effects; Equations; Inductance; Integrated circuit interconnections; Space heating; Temperature; Thermal conductivity; Thermal management; Very large scale integration;
Conference_Titel :
Solid-State and Integrated-Circuit Technology, 2008. ICSICT 2008. 9th International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-2185-5
Electronic_ISBN :
978-1-4244-2186-2
DOI :
10.1109/ICSICT.2008.4735040
