DocumentCode
2159342
Title
A reliable traversal clock delay evaluation including input slew effect with 3D parasitic interconnect RLC extraction
Author
Lee, Mankoo ; Chavez-reyes, Eduardo ; Zorinsky, Eldon
Author_Institution
Microprocessor Bus., Texas Instrum. Inc., Dallas, TX, USA
fYear
1997
fDate
5-8 May 1997
Firstpage
123
Lastpage
126
Abstract
For a large clock net, skew/delay evaluations were carried out using an accurate distributed parasitic network of 3D multilevel interconnect structures. We identified of 3D multilevel interconnect structures. We identified a reliable parasitic distributed RLC extraction method with the bounded local path 3D numerical simulation by using field solver. With the accurate RLC parasitic interconnect network and input driver for traversal clock delay evaluation, we investigated the impacts of variations in input slew, power supply voltage (Vcc ), and driver and load gate sizing on clock delay within the slow ramp region of driver gate as well as in the parasitic interconnect network. Input slew was found to be a dominant factor affecting clock delay sensitivity. This suggests that careful sizing of clock drivers, interconnects, and gate loads is required for minimal traversal clock delay. In addition, we used indirect on-chip electron beam probing to confirm that the simulated clock delays were in reasonable agreement with the measured delays
Keywords
VLSI; clocks; delays; driver circuits; electron beam testing; integrated circuit design; integrated circuit interconnections; integrated circuit testing; 3D multilevel interconnect structures; 3D parasitic interconnect; bounded local path; clock delay evaluation; clock delay sensitivity; clock drivers; distributed RLC extraction method; field solver; indirect on-chip electron beam probing; input driver; input slew effect; load gate sizing; power supply voltage; slow ramp region; traversal; CMOS technology; Clocks; Computational modeling; Data mining; Delay effects; Geometry; Microprocessors; Numerical simulation; Predictive models; Wiring;
fLanguage
English
Publisher
ieee
Conference_Titel
Custom Integrated Circuits Conference, 1997., Proceedings of the IEEE 1997
Conference_Location
Santa Clara, CA
Print_ISBN
0-7803-3669-0
Type
conf
DOI
10.1109/CICC.1997.606598
Filename
606598
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