Title :
3D technologies: Requiring more than 3 dimensions from concept to product
Author_Institution :
IMEC, Leuven
Abstract :
Future 3D products are envisioned to be smaller, more performing, more versatile in functionality, less power hungry and less costly than their 2D counterparts. Delivering that promise requires a multi faceted view on the product needs, technology and design requirements, equipment & materials developments and supply chain. This paper discusses the 3D product views and the need for standardization that enables technology roadmapping. The paper also presents an overview of selected 3D technology developments and related challenges to equipment and material needs.
Keywords :
integrated circuit design; integrated circuit packaging; product design; supply chains; 3D products; 3D technologies; design requirements; materials developments; supply chain; technology roadmapping; Assembly; Consumer electronics; Flexible manufacturing systems; Integrated circuit interconnections; Packaging; Production; Standardization; Supply chains; Through-silicon vias; Wiring;
Conference_Titel :
Interconnect Technology Conference, 2009. IITC 2009. IEEE International
Conference_Location :
Sapporo, Hokkaido
Print_ISBN :
978-1-4244-4492-2
Electronic_ISBN :
978-1-4244-4493-9
DOI :
10.1109/IITC.2009.5090340
