An 80 MHz digital signal processing multichip module made with the General Electric high density interconnect technology

A unique packaging and interconnect technology was used to build a multichip, four CPU element, pipeline parallel processing computer module using Texas Instruments TMS320C25 digital signal processors and companion circuits. The technology allowed a greater than fifteen-fold reduction in area over conventional chip packages mounted with printed-circuit-board methods. Reduced interconnect capacitance coupled with elimination of conventional package parasitics allowed clocking of commercial 40 MHz parts to nearly 90 MHz