Title :
Impact of chip package interaction on Cu/Ultra low-k interconnect delamination in Flip Chip Package with large die
Author :
Uchibori, Chihiro J. ; Lee, Michael
Author_Institution :
Fujitsu Labs. America, Inc., Sunnyvale, CA
Abstract :
Die size effects on chip package interaction for Cu/ultra low-k interconnect in flip chip package were investigated using mechanical and thermal analysis. The analytical and the theoretical study suggested that the die size effects were not caused only by the mismatch in CTE between die and substrate. By considering the number of bonding solder and its mechanical property during the cooling process, the die size dependency of CPI was successfully demonstrated.
Keywords :
chip scale packaging; copper; delamination; flip-chip devices; integrated circuit bonding; integrated circuit interconnections; integrated circuit reliability; low-k dielectric thin films; permittivity; soldering; thermal analysis; Cu; Cu-ultra low-k interconnect; bonding solder; chip package interaction; cooling; delamination; die size effects; dielectric constant; flip chip package; mechanical analysis; reliability; thermal analysis; Cooling; Delamination; Dielectric constant; Dielectric substrates; Flip chip; Mechanical factors; Packaging; Stress; Temperature distribution; Ultra large scale integration;
Conference_Titel :
Interconnect Technology Conference, 2009. IITC 2009. IEEE International
Conference_Location :
Sapporo, Hokkaido
Print_ISBN :
978-1-4244-4492-2
Electronic_ISBN :
978-1-4244-4493-9
DOI :
10.1109/IITC.2009.5090392
