Title :
Layout, design finish and packaging of a redundant signal multiprocessor architecture with WSI dimensions
Author :
Link, Theo ; Teich, Wolfgang ; Werner, Axel
Author_Institution :
Philips Components, Hamburg, Germany
Abstract :
An ASIC (application specific integrated circuit) design flow for the realization of a multiprocessor structure has been successfully established and verified. This design flow includes standard tools and project-specific extensions, especially for verification tasks and preparation of WSI (wafer scale integration) data fractioning. The achieved layout and factory finishing method `nonoverlapping hierarchy´ uses the regular multiproject wafer approach of an ASIC direct-write E-beam foundry and seems to have no area limits within the available wafer dimensions. Due to the extensive utilization of standard tools and flows wherever possible, a fast design and fabrication process for prototypes is guaranteed. This leads to a minimization of manpower, time, and processing costs
Keywords :
VLSI; application specific integrated circuits; circuit layout CAD; digital signal processing chips; multiprocessing systems; packaging; ASIC design flow; ASIC direct-write E-beam foundry; WSI data fractioning; WSI dimensions; application specific integrated circuit; design finish; fast design and fabrication process; minimization of manpower; multiprocessor structure; packaging; project-specific extensions; prototypes; redundant signal multiprocessor architecture; regular multiproject wafer approach; verification tasks; wafer scale integration; Application specific integrated circuits; Fabrication; Finishing; Foundries; Integrated circuit packaging; Process design; Production facilities; Prototypes; Signal design; Wafer scale integration;
Conference_Titel :
Wafer Scale Integration, 1991. Proceedings., [3rd] International Conference on
Conference_Location :
San Francisco, CA
Print_ISBN :
0-8186-9126-3
DOI :
10.1109/ICWSI.1991.151720