• DocumentCode
    2167017
  • Title

    A 100 nm node CMOS technology for practical SOC application requirement

  • Author

    Ono, A. ; Fukasaku, K. ; Hirai, T. ; Koyama, S. ; Makabe, M. ; Matsuda, T. ; Takimoto, M. ; Kunimune, Y. ; Ikezawa, N. ; Yamada, Y. ; Koba, F. ; Imai, K. ; Nakamura, N.

  • Author_Institution
    ULSI Device Dev. Div., NEC Corp., Kanagawa, Japan
  • fYear
    2001
  • fDate
    2-5 Dec. 2001
  • Abstract
    Reports a 1.0 V operation 100 nm technology node CMOS technology for generic SOC application. We have estimated that for practical SOC chip/package design, target spec of both I/sub OFF/ and I/sub G/ must be below 5 nA//spl mu/m in view of heat generation issue. The key point is how to obtain higher drive current under this I/sub OFF//I/sub G/ restriction. Taking this criteria into account, we optimized 1) the gate dielectric formation sequence consisting of RTH treatment and radical nitridation; 2) gate off-set spacer optimization for practical and robust 100 nm-node CMOS technology. Fabricated transistor, featuring 65 nm gate length and 1.6nm-EOT gate dielectric, show 640/260 /spl mu/A//spl mu/m of I/sub ON/ and 5n/5n A//spl mu/m of I/sub OFF/ with 1.0V operation.
  • Keywords
    CMOS integrated circuits; application specific integrated circuits; dielectric thin films; integrated circuit packaging; low-power electronics; nitridation; rapid thermal processing; 1.0 V; 1.6 nm; 100 nm; 65 nm; CMOS technology; RTH treatment; drive current; gate dielectric; gate dielectric formation sequence; gate length; gate off-set spacer optimization; generic SOC application; heat generation; radical nitridation; CMOS technology; Dielectric films; MOSFET circuits; Plastic packaging; Robustness; Space technology; Surface treatment; Temperature; Threshold voltage; Ultra large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 2001. IEDM '01. Technical Digest. International
  • Conference_Location
    Washington, DC, USA
  • Print_ISBN
    0-7803-7050-3
  • Type

    conf

  • DOI
    10.1109/IEDM.2001.979557
  • Filename
    979557