DocumentCode
2167092
Title
Effects of high-pressure high-temperature sintering on the microstructures of Pb0.55Te0.45
Author
Bo, Chen ; Zhen-Ya, Sun ; Ming-Fa, Li ; Shan-Yu, Wang ; Duan, Fan
Author_Institution
Inst. of High Temp. & High Pressure Phys., Wuhan Univ. of Technol., Wuhan, China
fYear
2011
fDate
9-11 Sept. 2011
Firstpage
3703
Lastpage
3706
Abstract
The n-type nonstoichiometric Pb0.55Te0.45 materials were prepared by melting and quenching combined with a subsequent high pressure high temperature (HPHT) sintering. After adequately annealed at 623 K in the argon atmosphere, the microstructures and thermal transferring performance of the prepared samples have been systematically investigated. The results show that the grains of samples were apparently refined, as well as a large quantity of twisty layered structure and numerous particles with a size of ~200nm distributing in the grain boundary can be observed. These refined microstructures significantly block the transports of phonons, and result in a remarkable reduction of the lattice thermal conductivity compared with the corresponding melting ingots.
Keywords
annealing; grain boundaries; grain refinement; heat transfer; lead compounds; melting; quenching (thermal); sintering; Pb0.55Te0.45; annealing; grain boundary; grain refining; high pressure high temperature sintering; lattice thermal conductivity; material microstructure; melting; melting ingots; n-type nonstoichiometric materials; quenching; thermal transfer; thermal transferring performance; Annealing; Conductivity; Lattices; Lead; Materials; Microstructure; Temperature measurement; HPHT; Pb0.55 Te0.45 ; microstructure; thermal properties;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics, Communications and Control (ICECC), 2011 International Conference on
Conference_Location
Ningbo
Print_ISBN
978-1-4577-0320-1
Type
conf
DOI
10.1109/ICECC.2011.6066270
Filename
6066270
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