DocumentCode
2167403
Title
Coupling of Solid-State and Electromagnetic Equations for Simulation of Wireless Packaged Geometries
Author
McGarvey, B. ; Tentzeris, M.
Author_Institution
The Georgia Institute of Technology, School of Electrical and Computer Engineering, Atlanta, GA 30332-0250, U.S.A., bmcgarvey@ece.gatech.edu
fYear
2001
fDate
24-26 Sept. 2001
Firstpage
1
Lastpage
4
Abstract
The balanced semiconductor solid-state equations as derived in [1] are efficiently coupled to Yee´s FDTD model for Maxwell´s electromagnetic equations. The resulting algorithm has capabilities of accurate and effective time-domain simulation of both passive and active devices, which can be used in wireless devices. A novel method that correlates the CFL requirements of the electromagnetic and the device simulator is presented and its application further enhances the numerical stability of the new numerical technique even for sub-micron devices. The discretization problems of a fully adaptive implementation are also discussed in detail.
Keywords
Electromagnetic coupling; Electromagnetic devices; Electromagnetic modeling; Finite difference methods; Geometry; Maxwell equations; Semiconductor device packaging; Solid modeling; Solid state circuits; Time domain analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Conference, 2001. 31st European
Conference_Location
London, England
Type
conf
DOI
10.1109/EUMA.2001.339177
Filename
4140245
Link To Document