• DocumentCode
    2167403
  • Title

    Coupling of Solid-State and Electromagnetic Equations for Simulation of Wireless Packaged Geometries

  • Author

    McGarvey, B. ; Tentzeris, M.

  • Author_Institution
    The Georgia Institute of Technology, School of Electrical and Computer Engineering, Atlanta, GA 30332-0250, U.S.A., bmcgarvey@ece.gatech.edu
  • fYear
    2001
  • fDate
    24-26 Sept. 2001
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    The balanced semiconductor solid-state equations as derived in [1] are efficiently coupled to Yee´s FDTD model for Maxwell´s electromagnetic equations. The resulting algorithm has capabilities of accurate and effective time-domain simulation of both passive and active devices, which can be used in wireless devices. A novel method that correlates the CFL requirements of the electromagnetic and the device simulator is presented and its application further enhances the numerical stability of the new numerical technique even for sub-micron devices. The discretization problems of a fully adaptive implementation are also discussed in detail.
  • Keywords
    Electromagnetic coupling; Electromagnetic devices; Electromagnetic modeling; Finite difference methods; Geometry; Maxwell equations; Semiconductor device packaging; Solid modeling; Solid state circuits; Time domain analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Conference, 2001. 31st European
  • Conference_Location
    London, England
  • Type

    conf

  • DOI
    10.1109/EUMA.2001.339177
  • Filename
    4140245