DocumentCode :
2167656
Title :
Chip-scale packaging of power devices and its application in integrated power electronics modules
Author :
Xingsheng Liu ; Jing, Xiuknan ; Lu, Guo-Qnan
Author_Institution :
Power Electron. Packaging Lab., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA
fYear :
2000
fDate :
2000
Firstpage :
370
Lastpage :
377
Abstract :
We present a power electronics packaging technology utilizing chip-scale packaged (CSP) power devices to build three-dimensional integrated power electronics modules (IPEMs). The chip-scale packaging structure, termed Die Dimensional Ball Grid Array (D2BGA), eliminates wise bonds by using stacked solder bumps to interconnect power chips. D2BGA package consists of a power chip, inner solder bumps, high-lead solder balls, and molding resin. It has the same lateral dimensions as the starting power chip, which makes high-density packaging and module miniature possible. This package enables the power chip to combine excellent thermal transfer, high current handling capability, improved electrical characteristics, and ultra-low profile packaging. Electrical tests show that the VCE(sat) and on-resistance of the D2BGA high speed insulated-gate-bipolar transistors (IGBTs) are improved by 20% and 30% respectively by eliminating the device´s wirebonds and other external interconnections, such as the leadframe. In this paper, we present the design, reliability, and processing issues of D2BGA package, and the implementation of these chip-scale packaged power devices in building 30 kW half-bridge power converter modules. The electrical and reliability test results of the packaged devices and the power modules are reported
Keywords :
ball grid arrays; chip scale packaging; insulated gate bipolar transistors; semiconductor device packaging; 30 kW; chip scale packaging; die dimensional ball grid array; electrical characteristics; half-bridge power converter; insulated gate bipolar transistor; power device; reliability; thermal transfer; three-dimensional integrated power electronics module; Cable insulation; Chip scale packaging; Dielectrics and electrical insulation; Electric variables; Electronic packaging thermal management; Electronics packaging; Insulated gate bipolar transistors; Power electronics; Resins; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components & Technology Conference, 2000. 2000 Proceedings. 50th
Conference_Location :
Las Vegas, NV
Print_ISBN :
0-7803-5908-9
Type :
conf
DOI :
10.1109/ECTC.2000.853179
Filename :
853179
Link To Document :
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